18-464: ULSI Technology Status and Roadmap for System on Chips and System in Package
This course will provide the necessary background for the state-of-the art technologies utilized by the leading edge products covering full spectrum of market drivers from mobile platforms, microprocessors, game chips to the highest performance systems for enterprise solutions computing. We will present all key components of such systems, i.e., logic, analog/RF and embedded memories. Then we present the technology roadmap for the upcoming generations in terms of device architecture options for logic devices (FinFET, Nanowire and Tunnel FET) and memories (Phase Change Memory , Resistive RAM and Magnetic RAM/Spin-Transfer Torque RAM) from the device level all the way to the system level specifications. The last part of the class will be devoted to the system integration issues, namely 3-dimensional integration approaches.
This course is designed for MS and PhD students from diverse areas: System/Hardware Design, Circuits and Devices/Nanofabrication and is aimed at bridging the gap among these areas.
This course is crosslisted with 18-664.
Last Modified: 2020-07-06 3:09PM
- Fall 2020
- Fall 2019
- Fall 2018